Announcement
Topics
  • Fabrication Technique and Characterization
  • Molecular Electronics (Basic Properties, Molecular Design, Interfacial Phenomena, and Spintronics etc.)
  • Molecular Photonics (Lasing, Nonlinear Optical, and Photorefractive Materials etc. )
  • Liquid Crystals, Polymers, and Other Soft-materials (Material Science, Gel, Colloid, and Carbon Fiber etc.)
  • Biomolecular Electronics, Bioanalysis, (Biomaterials, Bioelectronics, and Sensor etc.)
  • Organic Devices (LED, FET, Memory Devices, Organic Semiconductor LASER etc.)
  • Nanotechnology and Related Topics
  • [Topical Session] Organic Solar Cells
Registration Fee
The registration fee includes admission to technical sessions and one copy of Abstract Book.
*Member of sponsor and cooperative society
Banquet: 5,000 yen.
The registration site will open from Oct. 1, 2010 till Feb 28, 2011. The major credit cards are accepted for payment.
Organizing Comittee
Chair:
Kazuhiro Kudo (Chiba Univ.)
Vice Chair:
Kaoru Tamada (Tohoku Univ.)
Secretariat General:
Hirokazu Tada (Osaka Univ.)
Program Chair:
Takashi Fukuda (AIST)
Treasurer:
Takeshi Fukuda (Saitama Univ.)
Yasuhiro Ikezoe (RIKEN)
Publication:
Masateru Taniguchi (Osaka Univ.)
HP:
Kazuya Tada (Univ. Hyogo)
Local Arrangement:
Akito Masuhara (Yamagata Univ.)
Hiroshi Yabu (Tohoku Univ.)
Executive Members:
Shuichiro Kuwajima (METI)
Kohjiro Hara (AIST)
Takaaki Manaka (Tokyo Tech.)
Tomoyuki Yoshino (Prefectural Univ. Hiroshima)
Hiroki Maeda (DNP)
Noriyuki Yoshimoto (Iwate Univ.)
Taishi Takenobu (Waseda Univ.)
Toshiya Sakata (Univ. Tokyo)
Kenichi Nakayama (Yamagata Univ.)
Takeshi Yasuda (NIMS)
Sponsored by:
JSAP - the Japan Society of Applied Physics
Division of Molecular Electronics and Bioelectronics, JSAP

Supported by:
The Foundation of Sendai Tourism Convention Society    http://www.stcb.or.jp/eng/index.html

In corporation with:
The Surface Science Society of Japan
The Society of Polymer Science, Japan
The Japanese Liquid Crystal Society
Division of Colloid and Surface Chemistry, CSJ
The Institute of Electronics, Information, and Communication Engineers, Electronics Society

Contact:

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